MPI High-Power device characterization systems are specifically designed for on-wafer high power device testing. MPI TS150-HP and TS200-HP probe systems provide a complete 150 mm and 200 mm on-wafer solution. They are engineered to achieve low contact resistance measurements of power semiconductor under wide range of temperatures.
The MPI air-bearing stage design, with simple single-handed puck control, provides unsurpassed convenience of operation for fast XY navigation and quick wafer loading without compromising accurate and fine positioning capability with the additional fine and accurate 25x25mm XY-Theta micrometer movement.
Chuck options include MPI’s 10kV coaxial or 3kV triaxial ambient chucks or various ERS thermal chucks to support temperature measurement up to 300 °C. The thermal touch controller is designed to be mounted on the prober itself for quick and convenient operation.
MPI high power probing solutions include dedicated high voltage and high current probes which use MPI propriety multi-contact tips for reduced contact resistance. MPI’s high voltage probes are capable of low leakage current measurements during high voltage tests up to 3kV triaxial or 5 & 10 kV in coaxial set-ups.
The standard manual High Power probe systems are configured with a DarkBox providing an interlock for safety and EMI-shielding capability in order to insure low-noise, accurate , and safety measurements.
TS150-HP/TS200-HP can be configured with variety of instrument connection packages, which consists of necessary high voltage / high current probes and cabling accessories for optimal connection to the test instruments such as Keysight B15005 (3 kV or 10 kV) or Keithley 2600-PCT-XB, including integration of 8020 High Power Interface Panel.
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